Features: ` Ultra low offset voltage: 60V max` Rail-to rail input/output voltage swing` Operating from 2.7V to 5.5V` High-speed: 2.2MHz` Low consumption: 0.85mA` Supply voltage rejection ratio: 85dB` ESD protection 2kV` Latch-up immunity` Available in SOT23-5 micropackageApplication· Precision fil...
TS507: Features: ` Ultra low offset voltage: 60V max` Rail-to rail input/output voltage swing` Operating from 2.7V to 5.5V` High-speed: 2.2MHz` Low consumption: 0.85mA` Supply voltage rejection ratio: 85dB...
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Symbol |
Parameter |
Value |
Unit |
VCC |
Supply voltage 1 |
6 |
V |
Vid |
Differential Input Voltage 2 |
±5.5 |
V |
Vin |
Input Voltage 3 |
Gnd to Vcc |
V |
Toper |
Operating Free Air Temperature Range |
-40 to +125 |
|
Tstg |
Storage Temperature Range |
-65 to +150 |
|
Tj |
Maximum Junction Temperature |
150 |
|
Rthjc |
Thermal Resistance Junction to Case 4 SOT23-5 SO8 DIP8 |
81 28 80 |
/W |
Rthja |
Thermal Resistance Junction to Ambient - SOT23-5 |
256 |
/W |
ESD |
Human Body Model |
2 |
kV |
Lead Temperature (soldering, 10sec) |
260 |
The TS507 is a high performance rail-to-rail output amplifier with very low offset voltage. This amplifier uses a new trimming technique that yields ultra low offset voltages without any need for external nulling.
The circuit of the TS507 presents very stable electrical characteristics over the entire supply voltage range, and is particularly intended for professional nd telecom applications.
The TS507 is housed in the space-saving 5 pins SOT23 package that makes it well suited for battery-powered systems. This micropackage simplifies the PC board design because of it's ability to be placed in tight spaces (outside dimensions are: 2.8mm x 2.9mm)