Features: Wide Bandwidth (BW = 900 MHz Typ)Low Crosstalk (XTALK = −41 dB Typ)Low Bit-to-Bit Skew [tsk(o) = 0.2 ns Max]Low and Flat ON-State Resistance(ron = 4 Typ, ron(flat) = 0.7 Typ)Low Input/Output Capacitance(CON = 10 pF Typ)Rail-to-Rail Switching on Data I/O Ports(0 to 5 V)VDD Opera...
TS3L301: Features: Wide Bandwidth (BW = 900 MHz Typ)Low Crosstalk (XTALK = −41 dB Typ)Low Bit-to-Bit Skew [tsk(o) = 0.2 ns Max]Low and Flat ON-State Resistance(ron = 4 Typ, ron(flat) = 0.7 Typ)Low ...
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Supply voltage range, VDD .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . −0.5 V to 7 V
Switch I/O voltage range, V I/O (see Notes 1, 2, and 3) . . . . . . . . . . . . −0.5 V to 7 V
Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
I/O port clamp current, I I/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
ON-state switch current, II/O (see Note 4) .. . . . . . . . . . . . . . . . . . . . . . . . . ±128 mA
Continuous current through VDD or GND terminals . . . . . . . . . . .. . . . . . . . . ±100 mA
Package thermal impedance, JA (see Note 5): DGG package . . . .. . . . . . . . . 70°C/W
DGV package . . .. . . . . . . . . . 58°C/W
Storage temperature range, Tstg . . . .. . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground, unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
The TS3L301 provides a low and flat on-state resistance (ron) and an excellent on-resistance match. Low input/output capacitance, high-bandwidth, low skew, and low crosstalk among channels make this device suitable for various LAN applications, such as 10/100/1000 Base-T.