TS3431

Features: ·Adjustable output voltage: 1.24 to 24V·Several precision @ 25°C ±2%, ±1%, ±0.5% and ±0.25%· Sink current capability: 0.4 to 100mA· Industrial temperature range: -40 to +125°C· Performances compatible with industry standard TL431Application·Computers· Instrumentation· Battery chargers· S...

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SeekIC No. : 004528621 Detail

TS3431: Features: ·Adjustable output voltage: 1.24 to 24V·Several precision @ 25°C ±2%, ±1%, ±0.5% and ±0.25%· Sink current capability: 0.4 to 100mA· Industrial temperature range: -40 to +125°C· Performance...

floor Price/Ceiling Price

Part Number:
TS3431
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

·Adjustable output voltage: 1.24 to 24V
·Several precision @ 25°C
   ±2%, ±1%, ±0.5% and ±0.25%
· Sink current capability: 0.4 to 100mA
· Industrial temperature range: -40 to +125°C
· Performances compatible with industry standard TL431



Application

· Computers
· Instrumentation
· Battery chargers
· Switch mode power supply
· Battery operated equipments



Pinout

  Connection Diagram


Specifications

Symbol
Parameter
Value
Unit
VKA
Cathode to Anode Voltage
25
V
IK
Reverse Breakdown Current
-100 to +150
mA
IREF
Reference Current
-0.05 to10
mA
PD
Power Dissipation 1 SOT23-3
TO92
360
625
mW
TSTD
Storage Temperature
-65 to +150
EDS
Human Body Model (HBM)
2
kW
Machine Model (MM)
200
V
Tlead
Lead Temperature (soldering, 10 seconds)
250
(1) Pd has been calculated with Tamb = 25°C and Tj = 150°C and Rthjc = 66°C/W,
Rthja = 200°C/W for the TO92 package
Rthjc = 110°C/W, Rthja = 340°C/W for the SOT23-3L package



Description

The TS3431 is a programmable shunt voltage reference with guaranteed temperature stability over the entire temperature range of operation (-40 to +125°C). The output voltage may be set to any value between 1.24V and 24V with an external resistor bridge.

Available in SOT23-3 surface mount package, TS3431 can be designed in applications where space saving is a critical issue.




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