Features: ·12A, 20V RDS(ON)=3.9mΩ at 4.5Volts·12A, 20V Qg=19.8nC at 4.5Volts·Low profile package: less than 1mm height when mounted on PCB·Occupies only 1/3 the area of SO-8· Excellent thermal characteristics· High power and current handling capability· Lead free solder balls availableApplic...
TS12N20CS: Features: ·12A, 20V RDS(ON)=3.9mΩ at 4.5Volts·12A, 20V Qg=19.8nC at 4.5Volts·Low profile package: less than 1mm height when mounted on PCB·Occupies only 1/3 the area of SO-8· Excellent thermal...
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Parameter | Symbol | Value | Unit |
Drain-Source Voltage | VDSS | 20 | V |
Gate-Source Voltage | VGSS | +12 | V |
Drain Current Continuous Pulsed |
ID | 6 25 |
A A |
Power Dissipation (Steady State) | PD | 2.2 | W |
Operating and Storage Junction Temperature Range | TJ, TSTG | -55 to +150 | °C |
Taiwan Semiconductor's new low cost, state of the art MicroSurf™ lateral MOSFET process technology in chipscale bondwireless packaging minimizes PCB space and RDS(ON) plus provides an ultra-low Qg X RDS(ON) figure of merit of the TS12N20CS.