TS10B01G

Features: ` UL Recognized File # E-96005` Glass passivated junction` Ideal for printed circuit board` Reliable low cost construction` Plastic material has Underwriters Laboratory Flammability Classification 94V-0` Surge overload rating to 150 amperes peak` High case dielectric strength of 2000VRMS...

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SeekIC No. : 004528405 Detail

TS10B01G: Features: ` UL Recognized File # E-96005` Glass passivated junction` Ideal for printed circuit board` Reliable low cost construction` Plastic material has Underwriters Laboratory Flammability Classi...

floor Price/Ceiling Price

Part Number:
TS10B01G
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

` UL Recognized File # E-96005
` Glass passivated junction
` Ideal for printed circuit board
` Reliable low cost construction
` Plastic material has Underwriters Laboratory Flammability Classification 94V-0
` Surge overload rating to 150 amperes peak
` High case dielectric strength of 2000VRMS
` Isolated voltage from case to lead over 2500 volts.
` High temperature soldering guaranteed: 260oC / 10 seconds / 0.375"(9.5mm) lead length at 5 lbs (2.3Kg) tension



Specifications

CHARACTERISTICS
SYMBOL
TS10B
01G
TS10B
02G
TS10B
03G
TS10B
04G
TS10B
05G
TS10B
06G
TS10B
07G
UNIT
Maximum Recurrent Peak Reverse Voltage
VRRM
30
40
50
60
80
100
150
V
Maximum RMS Voltage
VRMS
21
28
35
42
56
70
105
V
Maximum DC Blocking Voltage
VDC
30
40
50
60
80
100
150
V
Maximum Average Forward Rectified Current
See Fig. 2
I(AV)
10
A
Peak Forward Surge Current
8.3ms Single Half Sine-Wave
Super Imposed on Rated Load (JEDEC Method)
IFSM

200

A
Maximum Instantaneous Forward Voltage
@ 5.0A
@ 10A
VF
1.0
1.1
V
Maximum DC Reverse Current @TJ=25
at Rated DC Bolcking Voltage @TJ=125
IR
5.0
500
uA
uA
Typical Thermal Resistance (Note3)
RJC
1.4
/W
Operating Temperature Range
TJ
-55 to +150
Storage Temperature Range
TSTG
-55 to + 150

Note: Thermal Resistance from Junction to Case with Device Mounted on 75mm x 75mm x 1.6mm Cu Plate Heatsink.




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