TRF8011

Features: ` Operates from 4.8V Power Supply for 900MHz Applications` Unconditionally Stable` Wide UHF Frequency Range: 800 MHz to 1000 MHz` Linear Ramp Control` Transmit Enable/Disable Control` Advanced BiCMOS Processing Technolo for Low-Power Consumption, High Efficiency, and Highly Linear Operat...

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TRF8011 Picture
SeekIC No. : 004528118 Detail

TRF8011: Features: ` Operates from 4.8V Power Supply for 900MHz Applications` Unconditionally Stable` Wide UHF Frequency Range: 800 MHz to 1000 MHz` Linear Ramp Control` Transmit Enable/Disable Control` Adva...

floor Price/Ceiling Price

Part Number:
TRF8011
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

` Operates from 4.8V Power Supply for   900MHz Applications
` Unconditionally Stable
` Wide UHF Frequency Range: 800 MHz to 1000 MHz
` Linear Ramp Control
` Transmit Enable/Disable Control
` Advanced BiCMOS Processing Technolo for Low-Power Consumption, High Efficiency, and Highly Linear Operation
` Minimum of External Components Required for Operation
` Thermally Enhanced Surface-Mount Package for Extremely Small Circuit Footprint



Pinout

  Connection Diagram


Specifications

Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 V to 5.6 V
Input voltage range at TXEN, VPC  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 V to 5.6 V
Input power at RFIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  10 dBm
Thermal resistance, junction to case, RJC (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5/W
Thermal resistance, junction to ambient, RJA (see Note 3)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32/W
Continuous total power dissipation at TA = 25 oC  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.9 W
Operating junction temperature, TJ  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Junction temperature TJ max   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 to 85
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 to 150



Description

The TRF8011 RF transmit driver amplifier is for use in 800 to 1000 MHz wireless communication systems. It consists of a two-stage amplifier and a linear ramp controller for burst control in TDMA (time-division multiple access) applications. Very few external components are required for operation. The input of TRF8011 is dc-blocked and requires no external matching. The output requires external matching suitable for the application frequency. The TRF8011 is enabled when the TXEN input is held high. A power control signal applied to the VPC input can ramp the RF output power up or down to meet ramp and spurious emission specifications in TDMA systems.

The power control signal of TRF8011 causes a linear change in output power as the voltage applied to VPC varies between 0 V and 3 V.  With the RF input power applied to RFIN at 5 dBm and TXEN high, adjusting VPC from 0 V to 3 V increases the output power from a typical value of 50 dBm to 24.5 dBm at 900 MHz. Forward isolation with the input power applied to RFIN at 5 dBm, VPC = 0 V, and TXEN high of TRF8011  is typically greater than 50 dB.

The TRF8011 is available in a thermally enhanced, surface-mount, 20-pin PowerPADTM  (PWP) thin-shrink small outline package (TSSOP) and is characterized for operation from 40°C to 85°C. The PWP package has a solderable pad that can improve the package thermal performance by bonding the pad to an external thermal plane. The pad of TRF8011 also acts as a low-inductance electrical path to ground and must be electrically connected to the PCB ground plane as a continuation of the regular package terminals that are designated GND.




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