TQRLC

The TQRLC is designed as one kind of pure passives process and produced by the TriQuint. It is targeted at high performance, small size passive-only circuits and utilizes over 9 m of gold metal. High density interconnections are accomplished with three thick global and one surface metal interconnect layers. The four metal layers are encapsulated in a high performance, low dielectric constant material that allows wiring flexibility and plastic packaging simplicity.

Features of the TQRLC are:(1)thick 4 Layer Metal; >9 m total thickness;(2)high density interconnects:3 global or 1 local;(3)high-Q passives; inductor Q>50
@ 2 GHz;(4)low cost:passives only;(5)thin film resistors;(6)dielectric encapsulated metals;(7)planarized surface;simplified plastic packaging;(8)volume production process.Also it can be used in passive components,circuits requiring high-Q passive elements,matching circuits,RF module front-end filters and general RF and microwave impedance matching.

If you want to know more information about this TQRLC,please download the datasheet in our website.Thank you.