TQPHT

Features: • D-Mode, -0.8 V Vp• InGaAs Active Layer pHEMT Process• 0.5 um Optical Lithography Gates• 17 V D-G Breakdown Voltage• High Density Interconnects:• 2 Global• 1 Local• High-Q Passives• Thin Film Resistors• High Value Capacitors...

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SeekIC No. : 004527929 Detail

TQPHT: Features: • D-Mode, -0.8 V Vp• InGaAs Active Layer pHEMT Process• 0.5 um Optical Lithography Gates• 17 V D-G Breakdown Voltage• High Density Interconnects:• 2 Glo...

floor Price/Ceiling Price

Part Number:
TQPHT
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2025/1/11

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Product Details

Description



Features:

• D-Mode, -0.8 V Vp
• InGaAs Active Layer pHEMT Process
• 0.5 um Optical Lithography Gates
• 17 V D-G Breakdown Voltage
• High Density Interconnects:
• 2 Global
• 1 Local
• High-Q Passives
• Thin Film Resistors
• High Value Capacitors
• Backside Vias Optional
• Based on Production 0.25 m pHEMT and Passives Processes
• TOM3 FET Models Available



Application

• Highly Efficient and Linear Power Amplifiers
• Low Loss, High Isolation Switches for Wireless Transceivers and Basestations
• Higher Supply Voltage Applications
• Integrated RF Front Ends LNA, SW, PA



Description

TriQuint's 0.5 m pHEMT process is based on our production released 0.25 m gate process. TQPHT substitutes lower cost optical lithography in place of e-beam and adds TriQuint's unique thick metal scheme. This process is targeted for high efficiency and linearity in power amplifiers, low noise amplifiers, and linear, low loss and high isolation RF switch applications. The TQPHT process offers a D-Mode pHEMT with a 0.8 V pinch off. The three metal interconnecting layers are encapsulated in a high performance dielectric that allows wiring flexibility, optimized die size and plastic packaging simplicity. Precision NiCr resistors and high value MIM capacitors of TQPHT are included allowing higher levels of integration, while maintaining smaller, cost effective die sizes.




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