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TPS54354

Features: *100 m

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SeekIC No. : 004526899 Detail

TPS54354: Features: *100 m

TPS54354 Data Sheet

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Part Number:
TPS54354
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

*100 m


Specifications

  UNIT
Input voltage range, VI VIN -0.3 V to 21.5 V
VSENSE -0.3 V to 8.0 V
UVLO -0.3 V to 8.0 V
SYNC -0.3 V to 4.0 V
ENA -0.3 V to 4.0 V
BOOT VI(PH) + 8.0 V
Output voltage range, VO VBIAS -0.3 to 8.5 V
LSG -0.3 to 8.5 V
SYNC -0.3 to 4.0 V
RT -0.3 to 4.0 V
PWRGD -0.3 to 6.0 V
COMP -0.3 to 4.0 V
PH -1.5 V to 22 V
Source current, IO
 PH Internally Limited (A)
LSG (Steady State Current) 10 mA
COMP, VBIAS 3 mA
Sink current, IS SYNC 5 mA
LSG (Steady State Current) 100 mA
PH (Steady State Current) 500 mA
COMP 3 mA
ENA, PWRGD 10 mA
Voltage differential AGND to PGND ±0.3 V
Operating virtual junction temperature range, TJ -40 to +150
Storage temperature, Tstg -65 to +150
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260



Description

  The TPS54354 is a medium output current synchronous buck PWM converter with an integrated high side MOSFET and a gate driver for an optional low side external MOSFET. Features include a high performance voltage error amplifier that enables maximum performance under transient conditions. The TPS54354 has an under-voltage lockout circuit to prevent start-up until the input voltage reaches a preset value; an internal slow-start circuit to limit in-rush currents; and a power good output to indicate valid output conditions. The synchronization feature of TPS54354 is configurable as either an input or an output for easy 180 out of phase synchronization.

  The TPS54354 devices are available in a thermally enhanced 16-pin TSSOP (PWP) PowerPAD™ package.TI provides evaluation modules and the SWIFT™ Designer software tool to aid in quickly achieving high-performance power supply designs to meet aggressive equipment development cycles.




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