Application• Low drain-source ON resistance: RDS (ON) = 44 m (typ.)• High forward transfer admittance: |Yfs| = 6.2 S (typ.)• Low leakage current: IDSS = −10 A (max) (VDS = −20 V)• Enhancement mode: Vth = −0.5 to −1.2 V(VDS = −10 V, ID = −...
TPCF8302: Application• Low drain-source ON resistance: RDS (ON) = 44 m (typ.)• High forward transfer admittance: |Yfs| = 6.2 S (typ.)• Low leakage current: IDSS = −10 A (max) (VDS = ...
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Characteristic | Symbol | Value | Units | |
Drain-source voltage | VDSS | -20 | V | |
Drain-gate voltage (RGS = 20 k) | VDGR | -20 | V | |
Gate-source voltage | VGSS | ±10 | V | |
Drain current | DC (Note 1) | ID | -3.0 | A |
Pulse (Note 1) | IDP | -12 | ||
Drain power dissipation (t = 5 s) (Note 2a) |
Single-device operation (Note 3a) |
PD(1) | 1.35 | W |
Single-device value at dual operation (Note 3b) |
PD(2) | 1.12 | ||
Drain power |
Single-device operation (Note 3a) |
PD(1) | 0.53 | |
Single-device value at dual operation (Note 3b) |
PD(2) | 0.33 | ||
Single-pulse avalanche energy (Note 4) | EAS | 0.58 | mJ | |
Avalanche current | IAR | -1.5 | A | |
Repetitive avalanche energy Single-device value at dual operation (Note 2a, 3b, 5) |
EAR | 0.11 | mJ | |
Channel temperature | Tch | 150 | ||
Storage temperature range | TSTG | - 55 to +150 |
Note: (Note 1), (Note 2), (Note 3), (Note 4), (Note 5) and (Note 6): See the next page.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling recautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Please handle with caution.