Features: • Low drain-source ON resistance: RDS (ON) = 72 m (typ.)• High forward transfer admittance: |Yfs| = 4.7S (typ.)• Low leakage current: IDSS = -10 A (max) (VDS = -20 V)• Enhancement-model: Vth = -0.5 to -1.2 V (VDS = -10 V, ID = -200A)PinoutSpecifications C...
TPCF8103: Features: • Low drain-source ON resistance: RDS (ON) = 72 m (typ.)• High forward transfer admittance: |Yfs| = 4.7S (typ.)• Low leakage current: IDSS = -10 A (max) (VDS = -20 V)R...
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Characteristics |
Symbol |
Rating |
Unit | |
Avalanche current |
VDSS |
-20 |
V | |
Drain-gate voltage (RGS = 20 k) |
VDGR |
-20 |
V | |
Gate-source voltage |
VGSS |
±8 |
V | |
Collector current |
DC (Note1) |
ID |
-2.7 |
A |
Pulse (Note1) |
IDP |
-10.8 | ||
forward current |
DC |
IF |
30 |
A |
1 ms |
IFP |
120 | ||
Drain power dissipation (t = 5 s) (Note 2a) |
PD |
2.5 |
W | |
Drain power dissipation (t = 5 s) (Note 2b) |
PD |
0.7 |
W | |
Single pulse avalanche energy (Note3) |
EAS |
1.2 |
mJ | |
Avalanche current |
IAR |
-1.35 |
A | |
Repetitive avalanche energy (Note4) |
EAR |
0.25 |
mJ | |
Channel temperature |
Tch |
150 |
||
Storage temperature range |
Tstg |
-55 to 150 |
Note: For (Note 1), (Note 2), (Note 3), (Note 4) and (Note 5), please refer to the next page.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic sensitive device. Please handle with caution.