Application`Low drain-source ON resistance: RDS(ON)= 19 m (typ.)`High forward transfer admittance: |Yfs| = 8 S (typ.)`Low leakage current: IDSS= 10A (max.) (VDS = 30 V)`Enhancement mode: Vth= 1.3 to 2.5 V (VDS= 10 V, ID= 1mA) PinoutSpecifications Characteristic Symbol Rating Unit...
TPCF8001: Application`Low drain-source ON resistance: RDS(ON)= 19 m (typ.)`High forward transfer admittance: |Yfs| = 8 S (typ.)`Low leakage current: IDSS= 10A (max.) (VDS = 30 V)`Enhancement mode: Vth= 1.3 to...
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Characteristic |
Symbol |
Rating |
Unit | |
Drain-source voltage Drain-gate voltage (RGS=20k) Gate-source voltage |
VDSS VDGR VGSS |
30 30 ±20 |
V V V | |
Drain current | DC (Note 1) |
ID |
7 |
A |
Pulse (Note 1) |
IDP |
28 | ||
Drain power dissipation (T=5s)(Note 2a) Drain power dissipation (T=5s)(Note 2b) Single pulse avalanche energy (Note 3) Avalanche current Repetitive avalanche energy (Note 4) Channel temperature Storage temperature range |
PD PD EAS IAR EAR Tch Tstg |
2.5 0.7 8 3.5 0.25 150 -55~150 |
W W mJ A mJ |
Note: For Notes 1 to 5, refer to the next page
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept an Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.