TPA4861

Supply voltage, V_DD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input voltage, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . .. . . . 0.3 V to V_DD +0.3 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . Internally Limited (see Dissipation Rating Table)
Operating free-air temperature range, T_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . 40°C to 85°C
Operating junction temperature range, T_J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . 40°C to 150°C
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

The TPA4861 is a bridge-tied load (BTL) audio power amplifier capable of delivering 1 W of continuous average power into an 8-W load at 0.2% THD+N from a 5-V power supply in voiceband frequencies (f < 5 kHz). A BTL configuration eliminates the need for external coupling capacitors on the output in most applications. Gain is,  ternally configured by means of two resistors and does not require compensation for settings of 2 to 20. Features of the amplifier are a shutdown function for power-sensitive applications as well as internal thermal and short-circuit protection. The TPA4861 works seamlessly with TI's TPA4860 in stereo applications. The amplifier is available in an 8-pin SOIC surface-mount package that reduces board space and facilitates automated assembly.