TPA311

Features: `Fully Specified for 3.3-V and 5-V Operation`Wide Power Supply Compatibility .5 V 5.5 V`Output Power for RL = 8 350 mW at VDD = 5 V, BTL 250 mW at VDD = 5 V, SE 250 mW at VDD = 3.3 V, BTL 75 mW at VDD = 3.3 V, SE`Shutdown Control IDD = 7 A at 3.3 V IDD = 60 A at 5 V`BTL to SE Mode Cont...

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TPA311 Picture
SeekIC No. : 004526049 Detail

TPA311: Features: `Fully Specified for 3.3-V and 5-V Operation`Wide Power Supply Compatibility .5 V 5.5 V`Output Power for RL = 8 350 mW at VDD = 5 V, BTL 250 mW at VDD = 5 V, SE 250 mW at VDD = 3.3 V, BT...

floor Price/Ceiling Price

Part Number:
TPA311
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

 `Fully Specified for 3.3-V and 5-V Operation
 `Wide Power Supply Compatibility .5 V 5.5 V
 `Output Power for RL = 8
350 mW at VDD = 5 V, BTL
250 mW at VDD = 5 V, SE
250 mW at VDD = 3.3 V, BTL
75 mW at VDD = 3.3 V, SE
 `Shutdown Control
IDD = 7 A at 3.3 V
IDD = 60 A at 5 V
 `BTL to SE Mode Control
 `Integrated Depop Circuitry
 `Thermal and Short-Circuit Protection
 `Surface Mount Packaging
SOIC
PowerPADE MSOP



Pinout

  Connection Diagram


Specifications

Supply voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . 0.3 V to VDD +0.3 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . internally limited (See Dissipation Rating Table)
Operating free-air temperature range, TA(see Table 3) . . . . . . . . . . . .  . . . . . . . . . . . . . . . . . . 40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.



Description

The TPA311 is a bridge-tied load (BTL) or ingle-ended (SE) audio power amplifier developed specially for low-voltage applications here internal speakers and external earphone peration are required. Operating with a 3.3-V upply, the TPA311 can deliver 250-mW of ontinuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although his device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as ellular communications. The BTL configuration eliminates the need for external coupling capacitors on the utput in most applications, which is particularly important for small battery-powered equipment. A unique eature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive s required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. his device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually liminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 0% and height by 40%.




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