TPA3100D2

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The TPA3100D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection shutdown. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad. See TI Technical Briefs SLMA002 for more information about using the TQFP thermal pad.
(3) In accordance with JEDEC Standard 22, Test Method A114-B.
(4) In accordance with JEDEC Standard 22, Test Method A115-A
(5) In accordance with JEDEC Standard 22, Test Method C101-A

The TPA3100D2 is a 20-W (per channel) efficient, Class-D audio power amplifier for driving bridged-tied  The TPA3100D2 can drive stereospeakers as low as 4  . The high efficiency of the  92%, eliminates the need for anexternal heat sink when playing music.

The gain of the amplifier TPA3100D2 is controlled by two gain select pins. The gain selections are 20, 26, 32, 36dB

The outputs of TPA3100D2 are fully protected against shorts to GND, V_CC, and output-to-output shorts with an auto  recovery feature and monitor output.