Features: `12-W/Ch Into an 8- Load From 15-V Supply `Efficient, Class-D Operation Eliminates Heatsinks and Reduces Power Supply Requirements`32-Step DC Volume Control From 40 dB to 36 dB`Line Outputs For External Headphone Amplifier With Volume Control`Regulated 5-V Supply Output for Powering TPA6...
TPA3004D2: Features: `12-W/Ch Into an 8- Load From 15-V Supply `Efficient, Class-D Operation Eliminates Heatsinks and Reduces Power Supply Requirements`32-Step DC Volume Control From 40 dB to 36 dB`Line Output...
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Supply voltage range: AVCC, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . 0.3 V to 20 V
Load impedance, RL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . 3.6
Input voltage range, VI: MODE, VREF, VARDIFF, VARMAX, VOLUME, FADE . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V
SD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . 0.3 V to VCC + 0.3 V
RINN, RINP, LINN, LINP . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . 0.3 V to 7 V
Supply current: AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . 120 mA
AVDDREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . .. . . . . .. . . . . . . . 10 mA
Output current, VAROUTL, VAROUTR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... . . . . . . ... . . . . . . . . 20 mA
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. See Dissipation Rating Table
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 85°C
Operating junction temperature range, TJ‡ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . 40°C to 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ The (TPA3004D2) incorporates an exposed PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction emperature that couldm permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package.