TPA0112

The TPA0112 is a stereo audio power amplifier in a 24-pin TSSOP thermally enhanced package capable of delivering 2 W of continuous RMS power per channel into 3-W  loads. This device minimizes the number of external components needed, simplifying the design, and freeing up board space for other features. When driving 1 W into 8-W  speakers, the TPA0112 has less than 0.8% THD+N across its specified frequency range.Included within this device is integrated depop circuitry that virtually eliminates transients that cause noise in the speakers.

Features of the TPA0112 are:(1)compatible with PC 99 desktop line-out into 10-kW  load; (2)internal gain control, which eliminates external gain-setting resistors; (3)2-W/Ch output power into 3-W  load; (4)PC-beep input; (5)depop circuitry; (6)stereo input MUX; (7)fully differential input; (8)low supply current and shutdown current; (9)surface-mount power packaging 24-Pin TSSOP powerPAD(TM).

The absolute maximum ratings of the TPA0112 can be summarized as:(1)supply voltage:6V;(2)input voltage:0.3 V to Vdd + 0.3 V;(3)storage temperature:-65 to 150;(4)operating junction temperature range:-40 to 150.Stresses beyond thoselisted under "absolute maximum ratings" may cause permanent damage to thedevice. These are stress ratings only, and functional operation of the deviceat these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-ratedconditions for extended periods may affect devicereliability.The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can be reliably achieved.