TOP221-227

DRAIN Voltage ................................................. -0.3 to 700 V
DRAIN Current Increase ( I_D) in 100 ns except during
blanking time ......................................... 0.1 x _{ILIMIT(MAX)⁽²⁾}
CONTROL Voltage ..................................... - 0.3 V to 9 V
CONTROL Current ...............................................100 mA
Storage Temperature ..................................... -65 to 125 °C
Operating Junction Temperature⁽³⁾ ................ -40 to 150 °C
Lead Temperature⁽⁴⁾ ................................................ 260 °C
Thermal Impedance: Y Package (_JA)⁽⁵⁾ .................70 °C/W
                                                  (_JC)⁽⁶⁾ ...................2 °C/W
                                P/G Package:
                                     (qJA) .........45 °C/W(7); 35 °C/W(8)
                                       (qJC)(6)...............................5 °C/W
Notes:
1. All voltages referenced to SOURCE, T_A = 25 °C.
2. Related to transformer saturation see Figure 13.
3. Normally limited by internal circuitry.
4. 1/16" from case for 5 seconds.
5. Free standing with no heatsink.
6. Measured at tab closest to plastic interface or source pin.
7. Soldered to 0.36 sq. inch (232 mm²), 2 oz. (610 gm/m²) copper clad.
8. Soldered to 1 sq. inch (645 mm²), 2 oz. (610 gm/m²) copper clad.

The second generation TOPSwitch-II family is more cost effective and provides several enhancements over the first generation TOPSwitch family. The TOPSwitch-II family extends the power range from 100W to 150W for 100/115/230 VAC input and from 50W to 90W for 85-265 VAC universal input. This brings TOPSwitch technology advantages to many new applications, i.e. TV, Monitor, Audio amplifiers, etc. Many significant circuit enhancements that reduce the sensitivity to board layout and line transients now make the design eveneasier. The standard 8L PDIP package option reduces cost in lower power, high efficiency applications. The internal lead frame of this package uses six of its pins to transfer heat from the chip directly to the board, eliminating the cost of a heat sink. TOPSwitch-II  incorporates all functions necessary for a switched mode control system into a three terminal monolithic IC: power MOSFET, PWM controller, high voltage start up circuit, loop compensation and fault protection circuitry.