TMP06

V_DD to GND............................................0.3 V to +7 V
Digital Input Voltage to GND......0.3 V to V_DD + 0.3 V
Maximum Output Current (OUT).......................±10 mA
Operating Temperature Range1....40°C to +150°C
Storage Temperature Range..........65°C to +160°C
Maximum Junction Temperature, TJmax ............150°C
  5-Lead SOT-23 (RJ-5)
   Power Dissipation2.......WMAX = (TJ max TA3)/JA
   Thermal Impedance4
   _JA, Junction-to-Ambient (Still Air).............240°C/W
  5-Lead SC-70 (KS-5)
   Power Dissipation2
   WMAX = (TJ max TA3)/JA
   Thermal Impedance4
   _JA, Junction-to-Ambient.......................534.7°C/W
   _JC, Junction-to-Case..........................172.3°C/W
IR Reflow Soldering
Peak Temperature.......................220°C (0°C/5°C)
Time at Peak Temperature..............10 sec to 20 sec
Ramp-Up Rate.................................2°C/s to 3°C/s
Ramp-Down Rate.........................................6°C/s
Time 25°C to Peak Temperature.......6 minutes max
IR Reflow Soldering (Pb-Free Package)
Peak Temperature..............................260°C (0°C)
Time at Peak Temperature..............20 sec to 40 sec
Ramp-Up Rate.........................................3°C/s max
Ramp-Down Rate.................................6°C/s max
Time 25°C to Peak Temperature......8 minutes max

1 It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond this limit affects device reliability.
2 SOT-23 values relate to the package being used on a 2-layer PCB and SC-70 values relate to the package being used on a 4-layer PCB. See Figure 4 for a plot of maximum power dissipation versus ambient temperature (T_A).
3  T_A = ambient temperature.
4 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled PCB mounted components.

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

The TMP05/TMP06 are monolithic temperature sensors that generate a modulated serial digital output (PWM), which varies in direct proportion to the temperature of the devices. The high period (TH) of the PWM remains static over all temperatures, while the low period (TL) varies. The B Grade version offers a high temperature accuracy of ±1°C from 0°C to 70°C with excellent transducer linearity. The digital output of the TMP05/ TMP06 is CMOS/TTL compatible and is easily interfaced to the serial inputs of most popular microprocessors. The flexible open-drain output of the TMP06 is capable of sinking 5 mA.

The TMP05/TMP06 are specified for operation at supply voltages from 3 V to 5.5 V. Operating at 3.3 V, the supply current is typically 370 A. The TMP05/TMP06 are rated for operation over the 40°C to +150°C temperature range. It is not recommended to operate these devices at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the devices. They are packaged in low cost, low area SC-70 and SOT-23 packages.

The TMP05/TMP06 have three modes of operation: continu-ously converting mode, daisy-chain mode, and one shot mode. A three-state FUNC input determines the mode in which the TMP05/TMP06 operate.

The CONV/IN input pin is used to determine the rate with which the TMP05/TMP06 measure temperature in continu-ously converting mode and one shot mode. In daisy-chain mode, the CONV/IN pin operates as the input to the daisy chain.