TM8SP64KPU

` Organization: TM4SP64KPU . . . 4 194 304 x 64 Bits TM8SP64KPU . . . 8 388 608 x 64 Bits
` Single 3.3-V Power Supply (±10% Tolerance)
` Designed for 66-MHz 4-Clock Systems
` JEDEC 168-Pin Dual-In-Line Memory Module (DIMM) Without Buffer for Use With Socket
` TM4SP64KPU - Uses Four 64M-Bit Synchronous Dynamic RAMs (SDRAMs) (4M * 16-Bit) in Plastic Thin Small-Outline Packages (TSOPs)
` TM8SP64KPU - Uses Eight 64M-Bit SDRAMs (4M * 16-Bit) in Plastic TSOPs
` Byte-Read/Write Capability
` Performance Ranges:
` High-Speed, Low-Noise Low-Voltage TTL (LVTTL) Interface
` Read Latencies 2 and 3 Supported
` Support Burst-Interleave and Burst-Interrupt Operations
` Burst Length Programmable to 1, 2, 4, 8, and Full Page
` Four Banks for On-Chip Interleaving (Gapless Access)
` Ambient Temperature Range 0°C to 70°C
` Gold-Plated Contacts
` Pipeline Architecture
` Serial Presence-Detect (SPD) Using EEPROM

Supply voltage range, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V
Voltage range on any pin (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V
Short-circuit output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Power dissipation: TM4SP64KPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 W
TM8SP64KPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 W
Ambient temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C to 125°C


† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltage values are with respect to VSS.

The TM8SP64KPU is a 32M-byte, 168-pin dual-in-line memory module (DIMM). The DIMM is composed of fourTMS664164DGE, 4194304 x 16-bit SDRAMs, each in a 400-mil, 54-pin plastic thin small-outline package (TSOP) mounted on a substrate with decoupling capacitors. See the TMS664164 data sheet (literature number SMOS690).

The TM8SP64KPU is a 64M-byte, 168-pin DIMM. The DIMM is composed of eight TMS664164DGE, 4194304 x 16-bit SDRAMs, each in a 400-mil, 54-pin plastic TSOP mounted on a substrate with decoupling capacitors. See the TMS664164 data sheet (literature number SMOS690).