TM16SM64JBN

Features:

· Organization: 16 777 216 x 64 Bits
· Single 3.3-V Power Supply (±10% Tolerance)
· Designed for 66-MHz Systems
· JEDEC 144-Pin Small Outline Dual-In-Line Memory Module (SODIMM) Without Buffer for Use With Socket
· Uses Sixteen 64M-Bit Synchronous Dynamic RAMs (SDRAMs) (8M × 8-Bit) Memory Chips Assembled in Board-On-Chip/Ball-Grid-Array (BOC/BGA) Packages.
· Byte-Read/Write Capability
· High-Speed, Low-Noise, Low-Voltage TTL (LVTTL) Interface
· Performance Ranges:
· Read Latencies 2 and 3 Supported
· Support Burst-Interleave and Burst-Interrupt Operations
· Burst Length Programmable to 1, 2, 4, and 8
· Four Banks for On-Chip Interleaving (Gapless Access)
· Ambient Temperature Range 0°C to 70°C
· Gold-Plated Contacts
· Pipeline Architecture
· Serial Presence Detect (SPD) Using EEPROM


Specifications

Supply voltage range, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V
Voltage range on any pin (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V
Short-circuit output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 W
Ambient temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C to 125°C


† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltage values are with respect to VSS.

Description

The TM16SM64JBN is a 64M-byte, 144-pin SODIMM. The SODIMM is composed of sixteen TMS664814DGE, 8388 608 x 8-bit SDRAMs, two per board-on-chip/ball-grid-array (BOC/BGA) package mounted on a substrate with decoupling capacitors. See the TMS664814 data sheet (literature number SMOS695).