TLV822 DUAL

􀀀· 2.7-V and 5-V Performance
􀀀· No Crossover Distortion
􀀀· Low Supply Current at V_CC+ = 5 V:
TLV821 . . . 0.3 mA Typ
TLV822 . . . 0.5 mA Typ
TLV824 . . . 1 mA Typ
􀀀· Rail-to-Rail Output Swing
􀀀· Pin-to-Pin Compatible with LMV821,LMV822, and LMV824 Devices
􀀀· Package Options Include Plastic Small-Outline (D), Small-Outline Transistor (SOT-23 DBV, SC-70 DCK), and Thin Shrink Small-Outline (PW) Packages

Supply voltage, V_CC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Differential input voltage, V_ID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5.5 V
Input voltage range, V_I (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . 0 to 5.5 V
Duration of output short circuit (one amplifier) to ground at (or below) T_A = 25,
VCC 3 5.5 V (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Operating virtual junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . .. . . . . 150
Package thermal impedance, q_JA (see Notes 4 and 5): D (8-pin) package . . . . . . . . . . . . . . . . . . . . . . 97/W
                                                                                        D (14-pin) package . . . . . . . . . . . . . . . . . . . . 86/W
                                                                                        DBV package . . . . . . . . . . . . . . . . . . . . . . . . 347/W
                                                                                        DCK package . . . . . . . . . . . . . . . . . . . . . . . . 389/W
                                                                                        PW (8-pin) package . . . . . . . . . . . . . . . . . . . 149/W
                                                                                        PW (14-pin) package . . . . . . . . . . . . . . . . . . 113/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or PW package . . . . . . . . . . . . .      . 260
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 to 150
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device.  hese are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated  onditions for extended periods may affect device reliability.
NOTES: 1. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with espect to the network GND.
2. Differential voltages are at IN+ with respect to IN.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/qJA. Selecting the maximum of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51.

The TLV822 DUAL devices are low-voltage (2.5 V to 5.5 V) low-power operational amplifiers, designed to be functionally and pin-to-pin compatible with the LMV821, LMV822, and LMV824 devices. Electrical characteristics are very similar to the LMV3xx operational amplifiers (low supply current, rail-to-rail outputs, input common-mode range, which includes ground). The TLV822 DUAL devices have a significantly higher bandwidth (8 MHz typically) and a 2.5-V/􀀀s slew rate. The TLV821 is a single, the TLV822 is a dual, and the TLV824 is a quad operational amplifier.

These TLV822 DUAL are the most cost-effective solution for applications requiring low-voltage/low-power operation and space-saving considerations. The TLV821 is available in the ultra-small DCK package, which is approximately half the size of the DBV package. The DCK package saves space on PC boards and enables the design of small portable electronic devices (cordless and cellular phones, laptops, PDAs, PCMIAs). It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.

The TLV821I, TLV822I, and TLV824I devices are characterized for operation from 40°C to 85°C.