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TLV5638-EP

Features: Controlled Baseline One Assembly/Test Site, One Fabrication SiteExtended Temperature Performance up to 55°C to 125°CEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product Change NotificationQualification Pedigree†Dual 12-Bit Voltage Output DACProgrammable Interna...

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SeekIC No. : 004522536 Detail

TLV5638-EP: Features: Controlled Baseline One Assembly/Test Site, One Fabrication SiteExtended Temperature Performance up to 55°C to 125°CEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Produc...

TLV5638-EP Data Sheet

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Part Number:
TLV5638-EP
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

Controlled Baseline
   One Assembly/Test Site, One Fabrication Site
Extended Temperature Performance up to 55°C to 125°C
Enhanced Diminishing Manufacturing Sources (DMS) Support
Enhanced Product Change Notification
Qualification Pedigree†
Dual 12-Bit Voltage Output DAC
Programmable Internal Reference
Programmable Settling Time: 1 s in Fast Mode, 3.5 s in Slow Mode
Compatible With TMS320 and SPI™Serial Ports
Differential Nonlinearity <0.5 LSB Typ
Monotonic Over Temperature


Application

Digital Servo Control Loops
Digital Offset and Gain Adjustment
Industrial Process Control
Machine and Motion Control Devices
Mass Storage Devices


Pinout

Connection Diagram


Specifications

Supply voltage (VDD to AGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Operating free-air temperature range, TA: TLV5638Q (see Note 1) . . . . . . . . . . . . . . . . . . . . . 40°C to 125°C
TLV5638M (see Note 1) . . . . . . . . . . . . . . . . . . . . . 55°C to 125°C
Storage temperature range, Tstg (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
Package thermal impedance, JA: D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: Long term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction
of overall device life. See www.ti.com/ep_quality for additional information on enhanced plastic packaging.


Description

The TLV5638-EP is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface allows glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.

The resistor string output voltage of TLV5638-EP is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage reference, the TLV5638 simplifies overall system design.

Because of its ability to source up to 1 mA, the reference of TLV5638-EP can also be used as a system reference. Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It is available in an 8-pin SOIC package to reduce board space.




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