TLSK1100C

Features: • Surface-mount devices• 3.2 (L) × 2.8 (W) × 1.9 (H) mm• Flat-top type• InGaAℓP LEDs• High luminous intensity• Low drive current, high-intensity light emission• Colors: Red, Orange, Yellow• Applications: automotive use, message signbo...

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TLSK1100C Picture
SeekIC No. : 004522205 Detail

TLSK1100C: Features: • Surface-mount devices• 3.2 (L) × 2.8 (W) × 1.9 (H) mm• Flat-top type• InGaAℓP LEDs• High luminous intensity• Low drive current, high-intensity l...

floor Price/Ceiling Price

Part Number:
TLSK1100C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

• Surface-mount devices
• 3.2 (L) × 2.8 (W) × 1.9 (H) mm
• Flat-top type
• InGaAℓP LEDs
• High luminous intensity
• Low drive current, high-intensity light emission
• Colors: Red, Orange, Yellow
• Applications: automotive use, message signboards, backlighting etc.
• Standard embossed tape packing: T11 (2000/reel) 8-mm tape reel





Specifications

Opto-Electrical Characteristics (Ta=25°C) Characteristics Symbol Test Condition Min Typ Max Unit Forward Voltage VF IF=20mA - 2.10
2.4
V Reverse Current IR VR=4V - - 10
A Luminous Intensity IV IF=20mA 250
500
- mcd Viewing Angle 2q1/2 - - 120° - deg Peak Wavelength lpeak IF=20mA - 623
- nm Dominant Wavelength lD IF=20mA - 613
- nm Spectral Line Half-Width Dl1/2 IF=20mA - 14
- nm

Product Name Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
Operation
Temperature
Topr ()
Storage
Temperature
Tstg ()
TLRK1100C 30 4 75 −40~100 −40~100
TLRMK1100C
TLSK1100C
TLOK1100C
TLYK1100C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Note 1: Forward current derating





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