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TLRPA1100

Features: • Surface-mount devices• 3.2 (L) × 2.9 (W) × 1.9 (H) mm• UV LED chip + RGB phosphor• Colors: bluish green, reddish purple• Topr / Tstg = -40 to 100°C• Reflow soldering is possible• Surface-mount devices• 3.2 (L) × 2.9 (W) × 1.9 (H) mm•...

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TLRPA1100: Features: • Surface-mount devices• 3.2 (L) × 2.9 (W) × 1.9 (H) mm• UV LED chip + RGB phosphor• Colors: bluish green, reddish purple• Topr / Tstg = -40 to 100°C• R...

TLRPA1100 Data Sheet

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Part Number:
TLRPA1100
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Surface-mount devices
• 3.2 (L) × 2.9 (W) × 1.9 (H) mm
• UV LED chip + RGB phosphor
• Colors: bluish green, reddish purple
• Topr / Tstg = -40 to 100°C
• Reflow soldering is possible
• Surface-mount devices
• 3.2 (L) × 2.9 (W) × 1.9 (H) mm
• UV LED chip + RGB phosphor
• Colors: bluish green, reddish purple
• Topr / Tstg = -40 to 100°C
• Reflow soldering is possible


Application

• automotive use, backlighting, etc.


Specifications

Product Name
Forward Current
IF (mA)
Please see Note 1
Power Dissipation
PD(mW)
Operating
Temperature
Topr()
Storage
Temperature
Tstg()
TLBGA1100
30
126
-40~100
-40~100
TLRPA1100

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Note 1: Forward current derating


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