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TLP831

Features: • Printed wiring board direct mounting type(with a locating pin)• Short lead type enabling automatic mounting: Lead length 3.4 ± 0.3mm• Board thickness: 1.6mm or less• Gap: 4.2mm• Resolution: Slit width 0.5mm• High current transfer ratio: IC / IF = 5% ...

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SeekIC No. : 004521902 Detail

TLP831: Features: • Printed wiring board direct mounting type(with a locating pin)• Short lead type enabling automatic mounting: Lead length 3.4 ± 0.3mm• Board thickness: 1.6mm or lessR...

TLP831 Data Sheet

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Part Number:
TLP831
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

• Printed wiring board direct mounting type
(with a locating pin)
• Short lead type enabling automatic mounting
: Lead length 3.4 ± 0.3mm
• Board thickness: 1.6mm or less
• Gap: 4.2mm
• Resolution: Slit width 0.5mm
• High current transfer ratio: IC / IF = 5% (min)
• High response speed: tr, tf = 15s (typ.)
• Detector side is of visible light cut type.
• Material of the package
: Polybutylene terephthalate (UL94V−0, black color)


Specifications

Characteristic Symbol Rating Unit
LED Forward current IF 50 mA
Forward current derating
(Ta > 25)		 PC / −0.33 mA/
Reverse voltage VR 5 V
Detector Collector−emitter voltage VCEO 35 V
Emitter−collector voltage VECO 5 V
Collector power dissipation PC 75 mW
Collector power dissipation
derating (Ta > 25)		 PC / −1 mA/
Collector current IC 50 mA
Operating temperature Topr −30~85
Storage temperature Tstg −40~100
Soldering temperature (5 s) (Note 1) Tso 260

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: At the location of 1.5mm from the resin package bottom




Description

The TLP831(F) photointerrupter consists of a high radiant power GaAs infrared LED and a Si phototransistor.
Housed in a short lead package, this device is ideal for automatic mounting.




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