TLP624-4

PHOTOCPLR QUAD TRANS-OUT 16-DIP

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TLP624-4 Picture
SeekIC No. : 003598882 Detail

TLP624-4: PHOTOCPLR QUAD TRANS-OUT 16-DIP

floor Price/Ceiling Price

Part Number:
TLP624-4
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Quick Details

Series: - Manufacturer: Toshiba
Number of Channels: 4 Input Type: DC
Voltage - Isolation: 5000Vrms Current Transfer Ratio (Min): 100% @ 1mA
Current Transfer Ratio (Max): 1200% @ 1mA Voltage - Output: 55V
Package / Case : LLP-40 Current - Output / Channel: 50mA
Current - DC Forward (If): 50mA Vce Saturation (Max): 400mV
Output Type: Transistor Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)    

Description

Series: -
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - Output / Channel: 50mA
Vce Saturation (Max): 400mV
Output Type: Transistor
Current - DC Forward (If): 50mA
Current Transfer Ratio (Min): 100% @ 1mA
Voltage - Output: 55V
Mounting Type: Through Hole
Packaging: Tube
Number of Channels: 4
Package / Case: 16-DIP (0.300", 7.62mm)
Manufacturer: Toshiba
Current Transfer Ratio (Max): 1200% @ 1mA


Features:

Options :-10mm lead spread - add G after part no.Surface mount - add SM after part no.Tape&reel-add SMT&R after part no.
High Current Transfer Ratio ( 50% min)
High Isolation Voltage (5.3kVRMS ,7.5kVPK )
High BVCEO ( 55Vmin )
All electrical parameters 100% tested
Low Input Current 0.5mA IF




Application

Computer terminals
Industrial systems controllers
Measuring instruments
Signal transmission between systems of different potentials and impedances




Pinout

  Connection Diagram


Specifications

Storage Temperature .........................-55°C to + 125°C
Operating Temperature ..................... -55°C to + 100°C
Lead Soldering Temperature
(1/16 inch (1.6mm) from case for 10 secs) .............260°C




Description

The TLP624, TLP624-2, TLP624-4 series of optically coupled isolators consist of infrared light emitting diodes and NPN silicon photo transistors in space efficient dual in line plastic packages.




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