PHOTOCOUPLER HS TRANS-OUT 8DIP
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Series: | - | Manufacturer: | Toshiba |
Number of Channels: | 1 | Input Type: | DC |
Voltage - Isolation: | 2500Vrms | Current Transfer Ratio (Min): | 20% @ 16mA |
Current Transfer Ratio (Max): | - | Voltage - Output: | 15V |
Package / Case : | LLP-40 | Current - Output / Channel: | 8mA |
Current - DC Forward (If): | 25mA | Vce Saturation (Max): | - |
Output Type: | Transistor with Vcc | Mounting Type: | Through Hole |
Package / Case: | 8-DIP (0.300", 7.62mm) |
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | |
LED |
Forward Current (Note 1) |
IF |
25 |
mA |
Forward Current Derating (Note 1) |
IFP |
50 |
mA | |
Peak transient forward current (Note 3) |
IFPT |
1 |
A | |
Reverse Voltage |
VR |
5 |
V | |
Diode power dissipation (Note 4) |
PD |
45 |
mW | |
DETECTOR |
Output current |
IO |
8 |
mA |
Peak output current |
IOP |
16 |
mA | |
Output voltage VO −0.5~15 V |
VO |
−0.5~15 |
V | |
Supply voltage |
VCC |
−0.5~15 |
V | |
Output power dissipation (Note 5) |
PO |
100 |
mW | |
Storage Temperature Range |
Tstg |
-55~125 |
||
Operating Temperature Range |
Topr |
-55~100 |
||
Lead Soldering Temperature (10 s)(Note 6) |
Tsol |
260 |
||
Isolation voltage (AC, 1 min., R.H. 60%) (Note 7) |
BVS |
1500 |
Vrms |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
(Note 1) Derate 0.8mA above 70.
(Note 2) 50% duty cycle,1ms pulse width.Derate 1.6mA / above 70.
(Note 3) Pulse width 1s, 300pps.
(Note 4) Derate 0.9mW / above 70.
(Note 5) Derate 2mW / above 70.
(Note 6) Soldering portion of lead: up to 2mm from body of the devise.
(Note 7) Device considered a two-terminal device: Pins 1, 2, 3 and 4 shorted together and pins 5, 6, 7 and 8 shorted together.
The TOSHIBA TLP559 consists of a GaAℓAs high−output light emitting diode and a high speed detector of one chip photo diode−transistor. This unit is 8−lead DIP package.
TLP559 has no internal base connection, and a faraday shield integrated on the photodetector chip provides an effective common mode noise transient immunity.
So TLP559 is suitable for application in noisy environmental condition.