PHOTOCOUPLER DARL TRAN OUT 6-DIP
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Features: · Peak Off-State Voltage : 400 V (min)· Trigger LED Current : 15 mA (max) (TLP3021(S)) 1...
Series: | - | Manufacturer: | Toshiba |
Number of Channels: | 1 | Input Type: | DC |
Voltage - Isolation: | 5000Vrms | Current Transfer Ratio (Min): | 1000% @ 1mA |
Current Transfer Ratio (Max): | - | Voltage - Output: | 300V |
Current - Output / Channel: | 150mA | Package / Case : | LLP-40 |
Current - DC Forward (If): | 60mA | Vce Saturation (Max): | 1.2V |
Output Type: | Darlington with Base | Mounting Type: | Through Hole |
Package / Case: | 6-DIP (0.300", 7.62mm) |
Current transfer ratio: 1000% (min) (IF = 1mA)
Isolation voltage: 5000 Vrms (min)
UL recognized: UL1577, file no. E67349
Characteristic |
Symbol |
Rating |
Unit | |
LED |
Forward current |
IF |
60 |
mA |
Forward current derating (Ta 39°C) |
IF /°C |
-0.7 |
mA /°C | |
Peak forward current (100s pulse,100pps) |
IFP |
1 |
A | |
Reverse voltage |
VR |
5 |
V | |
Junction temperature |
Tj |
125 |
°C | |
Detector |
Collector-emitter voltage |
VCEO |
300 |
V |
Collector-base voltage |
VCBO |
300 |
V | |
Emitter-collector voltage |
VECO |
0.3 |
V | |
Emitter-base voltage |
VEBO |
7 |
V | |
Collector current |
IC |
150 |
mA | |
Power dissipation |
PC |
300 |
mW | |
Power dissipation derating (Ta 25°C) |
PC /°C |
-3.0 |
mW /°C | |
Junction temperature |
Tj |
125 |
°C | |
Storage temperature range |
Tstg |
-55~125 |
°C | |
Operating temperature range |
Topr |
-55~100 |
°C | |
Lead soldering temperature (10s) |
Tsol |
260 |
°C | |
Total package power dissipation |
PT |
350 |
mW | |
Total package power dissipation derating (Ta25°C) |
PT /°C |
-3.5 |
mW /°C | |
Isolation voltage (AC, 1 min, R.H. 60%) (Note 1) |
BVS |
5000 |
Vrms |
(Note 1)Device considered a two terminal device: Pins 1, 2 and 3 shorted together and pins 4,5 and 6 shorted together.
The TOSHIBA TLP371 and TLP372 consists of a gallium arsenide infrared emitting diode optically coupled to a darlington connected photo−transistor which has an integrated base−emitter resistor to optimize switching speed and elevated temperature characteristics in a six lead plastic DIP package.
TLP371 is no−base internal connection for high−EMI environments.