Features: 3.2 (L) x 2.4 (W) x 2.4 (H) mm2 mm lens top typeInGaAlP LEDReflow soldering is possibleStandard embossed taping 4 mm pitch : T03 (1000 pcs/reel)ApplicationHigh−output backlighting sourceBattery−powered equipmentMessage boardsPortable devicesComputer peripheralsSpecifications ...
TLOE1005B: Features: 3.2 (L) x 2.4 (W) x 2.4 (H) mm2 mm lens top typeInGaAlP LEDReflow soldering is possibleStandard embossed taping 4 mm pitch : T03 (1000 pcs/reel)ApplicationHigh−output backlighting so...
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Features: ·Surface-mount devices ·2.0 (L)×1.25 (W)×1.1 (H) m·InGaAP LEDs ·It can be manufactured h...
Characteristic | Symbol | Max. | Unit |
Forward Current | IF | 25 | mA |
Reverse Voltage | VR | 4.00 | V |
Power Dissipation | PD | 60.00 | mW |
Operating Temperature | Topr | -40-85 | oC |
Storage Temperature | Tstg | -40-100 | oC |
Soldering Temperature | Tsol | 260 | oC |
Soldering Time | - | for 3 sec. max | - |