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TLMK3210

Features: • Utilizing AlInGaP, OMA* technology• Angle of half intensity ± = 60 °• Available in 8 mm tape• Luninous intensity, color and forward voltage categorized per packing unit• Luminous intensity ratio per packing unit IVmax/IVmin 1.6• ESD class 2• ...

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TLMK3210: Features: • Utilizing AlInGaP, OMA* technology• Angle of half intensity ± = 60 °• Available in 8 mm tape• Luninous intensity, color and forward voltage categorized per packi...

TLMK3210 Data Sheet

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Part Number:
TLMK3210
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

• Utilizing AlInGaP, OMA* technology
• Angle of half intensity ± = 60 °
• Available in 8 mm tape
• Luninous intensity, color and forward voltage categorized per packing unit
• Luminous intensity ratio per packing unit IVmax/IVmin 1.6
• ESD class 2
• Suitable for all soldering methodsaccording to CECC
• Lead-free device
* Organic Mirror Advanced


Application

`Traffic Signals and Signs
`Interior and exterior automotive lighting
`Indicator and backlighting purposes for audio, video, LCD's switches, symbols, illuminated advertising etc.


Specifications

PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage   VR 5 V
Forward current   IF 70 mA
Power dissipation Tamb 65 (290 K/W),
Tamb 70 (270 K/W)		 Ptot 180 mW
Junction temperature   Tj 125
Operating temperature range   Tamb - 40 to + 100
Storage temperature range   Tstg - 40 to + 100
Thermal resistance junction/ambient mounted on PC board FR4
optional paddesign (see page 7)		 RthJA 290 K/W
mounted on PC board FR4
recommended paddesign (see page 6)		 RthJA 270 K/W



Description

The TLMK3210 series is an advanced development in terms of heat dissipation.

The leadframe profile of this PLCC-3 SMD package is optimized to reduce the thermal resistance.

This allows higher drive current and doubles the light output compared to Vishay's high intensity SMD LEDin PLCC-2 package.




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