Features: • Utilizing AlInGaP technology• Available in 8 mm tape• Luminous intensity, color and forward voltage categorized per packing unit• Luminous intensity ratio per packing unit IVmax/IVmin 1.6• ESD class 2• Suitable for all soldering methods according to...
TLMK3200: Features: • Utilizing AlInGaP technology• Available in 8 mm tape• Luminous intensity, color and forward voltage categorized per packing unit• Luminous intensity ratio per pac...
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PARAMETER | TEST CONDITION | SYMBOL | VALUE | UNIT |
Reverse voltage2) | VR | 5 | V | |
Forward current | IF | 70 | mA | |
Power dissipation | Tamb 65 (290 K/W), Tamb 70(270 K/W) |
Ptot | 180 | mW |
Junction temperature | TJ | 125 | ||
Operating temperature range | Tamb | - 40 to + 100 | ||
Storage temperature range | Tstg | - 40to + 100 | ||
Thermal resistance junction/ambient | mounted on PC board FR4 optional paddesign (see page 11) |
RthJA | 290 | K/W |
mounted on PC board FR4 recommended paddesign (see page 10) |
RthJA | 270 | K/W |
The TLMK3200 series is an advanced development in terms of heat dissipation. The leadframe profile of this PLCC-3 SMD package is optimized to reduce the thermal resistance. This allows higher drive current and doubles the light output compared to Vishay's high intensity SMD LED in PLCC-2 package.