Features: SMD LED with exceptional brightness Multicolored Luminous intensity categorized Compatible with automatic placement equipment EIA and ICE standard package Compatible with infrared, vapor phase and wave solder processes according to CECC Available in 8 mm tape Low profile package Non-diff...
TLMG3100: Features: SMD LED with exceptional brightness Multicolored Luminous intensity categorized Compatible with automatic placement equipment EIA and ICE standard package Compatible with infrared, vapor p...
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Parameter |
Test Conditions |
Symbol |
Value |
Unit |
Reverse voltage per diode |
IR = 10 A |
VR |
6 |
V |
DC Forward current per diode |
Tamb 60 °C |
IF |
30 |
mA |
Surge forward current per diode |
tp 10 s |
IFSM |
0.5 |
A |
Power dissipation per diode |
Tamb 60 °C |
PV |
100 |
mW |
Junction temperature |
Tj |
100 |
°C | |
Operating temperature range |
Tamb |
40 to +100 |
°C | |
Storage temperature range |
Tstg |
55 to +100 |
°C | |
Soldering temperature |
t 5 s |
Tsd |
260 |
°C |
Thermal resistance junction/ambient |
mounted on PC board (pad size > 16 mm2) |
RthJA |
400 |
K/W |
The TLMG3100 has been designed to meet the increasing demand for surface mounting technology.
The package of the TLMG3100 is the PLCC3 (equivalent to a size B tantalum capacitor).
TLMG3100 consists of a lead frame which is surrounded with a white thermoplast. The reflector inside this package is filled up with clear epoxy.
The TLMG3100 consists of a red and green chip. So it is possible to choose the color in one device.