TLK1221

Features: ` 0.6- to 1.3-Gigabits Per Second (Gbps) Serializer/Deserializer` Low Power Consumption 250 mW (typ) at 1.25 Gbps` LVPECL-Compatible Differential I/O on High-Speed Interface` Single Monolithic PLL Design` Support For 10-Bit Interface` Receiver Differential-Input Thresholds, 200-mV Minim...

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SeekIC No. : 004521254 Detail

TLK1221: Features: ` 0.6- to 1.3-Gigabits Per Second (Gbps) Serializer/Deserializer` Low Power Consumption 250 mW (typ) at 1.25 Gbps` LVPECL-Compatible Differential I/O on High-Speed Interface` Single Monol...

floor Price/Ceiling Price

Part Number:
TLK1221
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/11

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Product Details

Description



Features:

` 0.6- to 1.3-Gigabits Per Second (Gbps)
  Serializer/Deserializer
` Low Power Consumption 250 mW (typ) at 1.25 Gbps
` LVPECL-Compatible Differential I/O on High-Speed Interface
` Single Monolithic PLL Design
` Support For 10-Bit Interface
` Receiver Differential-Input Thresholds, 200-mV Minimum
` Industrial Temperature Range From 40°C to 85°C
` IEEE 802.3 Gigabit Ethernet Compliant
` Designed in 0.25 mm CMOS Technology
` No External Filter Capacitors Required
` Comprehensive Suite of Built-In Testability
` 2.5-V Supply Voltage for Lowest-Power Operation
` 3.3-V Tolerant on LVTTL Inputs
` Hot Plug Protection
` 40-Pin 6-mm ´ 6-mm QFN PowerPAD™ Package



Pinout

  Connection Diagram


Specifications

 
VALUE(1)
UNIT
VDD   Supply voltage(2)
0.3 to 3
V
V     Input voltage range at TTL terminals
0.5 to 4
V
V     Input voltage range at other terminals
0.3 to VDD + 0.3
V
ESD   Electrostatic discharge
CDM: 1, HBM: 2
kV
Tstg   Storage temperature
65 to 150
TA     Characterized free-air temperature range
40 to 85

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.



Description

The TLK1221 gigabit Ethernet transceiver provides for high-speed full-duplex point-to-point data transmissions. These devices are based on the timing requirements of the 10-bit interface specification by the IEEE 802.3 Gigabit Ethernet specification. The TLK1221 supports data rates from 0.6 Gbps through 1.3 Gbps.

The primary application of these devices is to provide building blocks for point-to-point baseband data transmission over controlled-impedance media of 50 . The transmission media can be printed-circuit board traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

The TLK1221 performs the data serialization, deserialization, and clock extraction functions for a physical layer interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1 Gbps of data bandwidth over a copper or optical media interface.

This device supports the defined 10-bit interface (TBI). In the TBI mode, the serializer/deserializer (SERDES) accepts 10-bit wide 8b/10b parallel encoded data bytes. The parallel data bytes are serialized and transmitteddifferentially at PECL-compatible voltage levels. The SERDES extracts clock information from the input serial stream and deserializes the data, outputting a parallel 10-bit data byte.

A comprehensive series of built-in tests is provided for self-test purposes, including loopback and pseudorandom binary sequence (PRBS) generation and verification.

The TLK1221 is housed in a high-performance, thermally enhanced, 40-pin QFN package. Use of this package does not require any special considerations except to note that the pad, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is required that the TLK1221 pad be soldered to the thermal land on the board as it serves as the main ground connection for the device. The TLK1221 is characterized for operation from 40°C to 85°C.

This device uses a 2.5-V supply. The I/O section is 3.3-V compatible. With the 2.5-V supply, the chipset is very power-efficient, dissipating less than 200 mW typical power when operating at 1.25 Gbps.

The TLK1221 is designed to be hot-plug capable. A power-on reset causes RBC0, RBC1, the parallel output signal terminals, TXP, and TXN to be held in the high-impedance state.




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