Features: • Lead(Pb)-free products (lead: Sn-Ag-Cu)• 3mm package• InGaAℓP technology• All plastic mold typeTLGU53T(F), TLPGU53T(F) : Transparent lensTLGU53C(F), TLPGU53C(F) : Colored, transparent lensTLGU53D(F), TLPGU53D(F) : Colored, diffused lens• Colors: gree...
TLGU53C(F): Features: • Lead(Pb)-free products (lead: Sn-Ag-Cu)• 3mm package• InGaAℓP technology• All plastic mold typeTLGU53T(F), TLPGU53T(F) : Transparent lensTLGU53C(F), TLPGU53...
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Features: ·Lead(Pb)-free products (lead: Sn-Ag-Cu)·3mm package ·InGaAP technology ·All plastic mol...
Product Name |
Forward Current IF (mA) |
Reverse Voltage VR (V) |
Power Dissipation PD (mW) |
Operating Temperature Topr () |
Storage Temperature Tstg () |
TLGU53T(F) |
30 |
4 |
72 |
−40~100 |
−40~120 |
TLGU53C(F) |
30 |
4 |
72 | ||
TLGU53D(F) |
30 |
4 |
72 | ||
TLPGU53T(F) |
30 |
4 |
72 | ||
TLPGU53C(F) |
30 |
4 |
72 | ||
TLPGU53D(F) |
30 |
4 |
72 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).