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TLBA1100B

Features: • Surface-mount devices• 3.2 (L) * 2.8 (W) * 1.9 (H) mm• Flat-top type• GaN LED• Low drive current, high-intensity light emission• Colors: Blue d=465nm(typ)• Pb free reflow soldering is possible• Applications: automotive use, message signbo...

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TLBA1100B: Features: • Surface-mount devices• 3.2 (L) * 2.8 (W) * 1.9 (H) mm• Flat-top type• GaN LED• Low drive current, high-intensity light emission• Colors: Blue d=465nm(...

TLBA1100B Data Sheet

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Part Number:
TLBA1100B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/19

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Product Details

Description



Features:

• Surface-mount devices
• 3.2 (L) * 2.8 (W) * 1.9 (H) mm
• Flat-top type
• GaN LED
• Low drive current, high-intensity light emission
• Colors: Blue d=465nm(typ)
• Pb free reflow soldering is possible
• Applications: automotive use, message signboards, backlighting etc.
• Standard embossed tape packing: T11 (2000/reel)
                                                          8-mm tape reel


Specifications

Product Name
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
Operation Temperature
Topr (°C)
Storage Temperature
Tstg (°C)
TLBA1100B
30
4
126
−40~100
−40~100

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Note 1: Forward current derating


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