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THM1001TE

Features: • +23 dBm at 44% Power Added Efficiency• Temperature stability better than 1dB• Power-control and Power-down modes• Single 3.3 V Supply Operation• Temperature Rating: -40C to +85C• 8 lead Exposed Pad MSOP8 Plastic PackageApplication• Bluetoothtm ...

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SeekIC No. : 004518700 Detail

THM1001TE: Features: • +23 dBm at 44% Power Added Efficiency• Temperature stability better than 1dB• Power-control and Power-down modes• Single 3.3 V Supply Operation• Temperature...

THM1001TE Data Sheet

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Part Number:
THM1001TE
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/18

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Product Details

Description



Features:

• +23 dBm at 44% Power Added Efficiency
• Temperature stability better than 1dB
• Power-control and Power-down modes
• Single 3.3 V Supply Operation
• Temperature Rating: -40C to +85C
• 8 lead Exposed Pad MSOP8 Plastic Package


Application

• Bluetoothtm Wireless Technology (Class 1)
• USB Dongles, modules
• PCMCIA, Flash cards
• Access Points
• 2.4GHz cordless telephone


Pinout

Connection Diagram


Specifications

Parameter
Symbol
Unit
Min
Max
Supply Voltage
Vcc
V
-0.3
+3.6
Control Voltage
VCTL
V
-0.3
Vcc
Ramping Voltage
VRAMP
V
-0.3
Vcc
IN
 RF Input Power
dBm
+8
TA
Operating Temperature Range
-40
+85
Tstg
 Storage Temperature Range
-40
+150
Tj
 Maximum Junction Temperature
+150
Operation in excess of any one of above Absolute Maximum Ratings may result inpermanent damage.
Handling and assembly of this device should be at ESD protected workstations.


Description

A monolithic, high-efficiency, silicon-germanium power amplifier IC, the THM1001TE is designed for 2.4GHz wireless applications including Bluetoothtm Class 1 wireless technology and 2.4GHz cordless telephone applications. It delivers +23 dBm output power, making it capable of overcoming insertion losses of up to 3.0dB between amplifier output and antenna.

The silicon-germanium structure of the THM1001TE, and its exposed-die-pad package, soldered to the system PCB, provide high thermal conductivity and a subsequently low junction temperature.




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