TGS2304-SCC

RF Switch ICs DC-20 GHz SP4T VPIN Switch

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TGS2304-SCC Picture
SeekIC No. : 00632177 Detail

TGS2304-SCC: RF Switch ICs DC-20 GHz SP4T VPIN Switch

floor Price/Ceiling Price

US $ 67.91~83.84 / Piece | Get Latest Price
Part Number:
TGS2304-SCC
Mfg:
TriQuint Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 0~25
  • 25~100
  • Unit Price
  • $83.84
  • $67.91
  • Processing time
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2025/1/12

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Product Details

Description

Number of Switches :
Switch Configuration :
Insertion Loss :
Off Isolation (Typ) :
Maximum Operating Temperature :
Minimum Operating Temperature :
Mounting Style :
Package / Case :
Packaging :


Features:

• DC to 20 GHz Frequency Range
• 0.6 dB Typical Midband Insertion Loss
• 38 dB Typical Midband Isolation
• Typical Input / Output SWR 1.2:1,Midband
• 23 dB Typical Input Power at 1 dB Gain Compression
• 2.540 x 3.556 x 0.1016 mm (0.100 x 0.140 x 0.004 in.)




Specifications

Forw ard Voltage, VF...................2.5 V
Forw ard Voltage, VR....................30 V
Bias current........................50 mA
Input continuous w ave pow er, PIN............  2 W
Mounting temperature (30 sec.), TM........... .320oC
Storage temperature range, TSTG........ ..-65 to 175oC



Description

The TriQuint TGS2304-SCC is a GaAs monolithic PIN-diode single-pole, four-throw switch, in chip form, that operates from DC to 20 GHz. Each arm consists of one series and two shunt PIN diodes. At a bias current of 10 mA per RF output arm,typical midband insertion loss is 0.6 dB; midband return loss is approximately 20dB. Typical isolation at 10 mA bias is 40 dB. Insertion loss and isolation can be adjusted by varying the switch arm bias currents.

Using a GaAs vertical PIN diode process, TriQuint has produced switches with high power handling capability, low on-state resistance, and low off-state capacitance.The higher cutoff frequency of the PIN diode element makes this switch ideal for broadband electronic components and communication systems wherein the MMIC construction offers reduced size, cost, and assembly time. Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attach methods as well as thermocompression and thermosonic wire-bonding processes.




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