RF Amplifier 2.0-20GHz LNA AGC
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Features: • HFET Technology• 12.5 -15.5 GHz Frequency Range• > 3W Nominal Pou...
Features: • 0.25um pHEMT Technology• 36-40 GHz Frequency Range• 22 dBm Nominal P...
Type : | Wideband AGC Amplifier | Operating Frequency : | 2 GHz to 20 GHz | ||
Noise Figure : | 3.5 dB | Operating Supply Voltage : | 9 V | ||
Supply Current : | 220 mA | Package / Case : | 3.4 mm x 2 mm |
SYMBOL | PARAMETER | VALUE | NOTES |
V+ | Positive Supply Voltage | 9V | 4/ |
V- | Negative Supply Voltage Range | -5 to 0 V | |
I+ | Positive Supply Current (Quiescent) | 220mA | 4/ |
| IG | | Gate Supply Current | 8.73mA | |
PIN | Input Continuous Wave Power | 23TBD | |
PD | Power Dissipation | 2.16TBD | 3/ 4/ |
TCH | Operating Channel Temperature | 150 | 1/ 2/ |
TM | Mounting Temperature (30 Seconds) | 320 | |
TSTG | Storage Temperature | -65 to 150 |
1/ These ratings apply to each individual FET.
2/ Junction operating temperature will directly affect the device median time to failure (TM). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels.
3/ When operated at this bias condition with a base plate temperature of 70 0C, the median life is reduced from 3.7E+11 to 1.9E+8 hours.
4/ Combinations of supply voltage, supply current, input power, and output power shall not exceed PD.
5/ These ratings represent the maximum operable values for this device.
The TriQuint TGA1342-SCC is a monolithic dual gate low noise distributed amplifier with AGC via the control gate. This LNA operates from 2 to 20 GHz. Nine 120um gatewidth FETs typically provide 3.5 dB of noise figure, 17.5 dBm of output power at 1 dB gain compression, and 9 dB small signal gain.
Typical input return loss and output return loss are 20 dB. Ground is provided to the circuitry through vias to the backside metallization. The TGA1342- SCC low noise distributed amplifier is suitable for a commercial radio and variety of wideband electronic warfare systems such as radar warning receivers, electronic counter measures, decoys, jammers and phased array systems.
Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment methods as well as the thermocompression and thermosonic wire bonding processes. The TGA1342-SCC is supplied in chip form and is assembled using automated equipment.
Technical/Catalog Information | TGA1342-SCC |
Vendor | Triquint Semiconductor Inc |
Category | RF and RFID |
Function | Amplifier |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | TGA1342 SCC TGA1342SCC |