DescriptionThe TG50C60 is designed as one kind of Ka band low noise amplifier that can be used in point-to-point radio and point-to-multipoint communications applications. Features of the TG50C60 are:(1)0.25um pHEMT technology; (2)23-29 GHz frequency range; (3)3.1 dB nominal noise figure 28GHz; (4...
TG50C60: DescriptionThe TG50C60 is designed as one kind of Ka band low noise amplifier that can be used in point-to-point radio and point-to-multipoint communications applications. Features of the TG50C60 ar...
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The TG50C60 is designed as one kind of Ka band low noise amplifier that can be used in point-to-point radio and point-to-multipoint communications applications. Features of the TG50C60 are:(1)0.25um pHEMT technology; (2)23-29 GHz frequency range; (3)3.1 dB nominal noise figure 28GHz; (4)17 db nominal gain; (5)OTOI > 22dBm; (6)5V, 50 mA self-bias.
The reflow process assembly notes of the TG50C60 can be summarized as:(1)AuSn (80/20) solder with limited exposure to temperatures at or above 300 ; (2)alloy station or conveyor furnace with reducing atmosphere; (3)no fluxes should be utilized; (4)coefficient of thermal expansion matching is critical for long term reliability; (5)storage in dry nitrogen atmosphere.
The component placement and adhesive attachment assembly notes of this device can be summarized as:(1)vacuum pencils and/or vacuum collets preferred method of pick up; (2)avoidance of air bridges during placement; (3)force impact critical during auto placement; (4)organic attachment can be used in low-power applications; (5)curing should be done in a convection oven; proper exhaust is a safety concern; (6)microwave or radiant curing should not be used because of differential heating; (7)coefficient of thermal expansion matching is critical. If you want to know more information about it, please download the datasheet in www.seekic.com or www.chinaicmart.com .