TFP401

Supply voltage range, DV_DD, AV_DD, OV_DD, PV_DD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 4 V
Input voltage range, logic/analog signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  .. -0.3 V to 4 V
Operating ambient temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to 150°C
Case temperature for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . ..260°C
Package power dissipation/PowerPAD^TM: Soldered (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . .4.3 W
                                                                 Not soldered (see Note 2) . . . . . . . . . . . . . . . . . . . . . 2.7 W
ESD Protection, all pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   2.5 KV Human Body Model
JEDEC latchup (EIA/JESD78) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

The Texas Instruments TFP401 and TFP401A are TI PanelBus^TM flat panel display products, part of acomprehensive family of end-to-end DVI 1.0 compliant solutions. Targeted primarily at desktop LCD monitors and digital projectors, the TFP401/401A finds applications in any design requiring high-speed digital interface.

The TFP401/401A supports display resolutions up to UXGA in 24-bit true color pixel format. The TFP401/401Aoffers design flexibility to drive one or two pixels per clock, supports TFT or DSTN panels, and provides an option for time staggered pixel outputs for reduced ground bounce.

PowerPAD^TM advanced packaging technology results in best of class power dissipation, footprint, and ultra-low ground inductance.

The TFP401/401A combines PanelBus^TM circuit innovation with TI's advanced 0.18-m EPIC-5^TM CMOS process technology, along with TI PowerPAD^TM package technology to achieve a reliable, low-powered, low noise, high-speed digital interface solution.