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TFMCJ5.0

Features: * Plastic package has underwriters laboratory* Glass passivated chip construction* 1500 watt surage capability at 1ms* Excellent clamping capability* Low zener impedance* Fast response timeSpecifications RATINGS SYMBOL VALUE UNITS Peak Power Dissipation with a 10/1000uS (Note ...

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SeekIC No. : 004518103 Detail

TFMCJ5.0: Features: * Plastic package has underwriters laboratory* Glass passivated chip construction* 1500 watt surage capability at 1ms* Excellent clamping capability* Low zener impedance* Fast response tim...

TFMCJ5.0 Data Sheet

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Part Number:
TFMCJ5.0
Supply Ability:
5000

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  • 1~5000
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  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

* Plastic package has underwriters laboratory
* Glass passivated chip construction
* 1500 watt surage capability at 1ms
* Excellent clamping capability
* Low zener impedance
* Fast response time


Specifications

RATINGS SYMBOL VALUE UNITS
Peak Power Dissipation with a 10/1000uS (Note 1,2,5 Fig.1) PPPM Minimum 1500 Watts
Peak Power Dissipation with a 10/1000uS (Note 1,2,5 Fig.1) IPPM SEE TABLE 1 Amps
Steady State Power Dissipation (Note 3) PM(AV) 5.0 Watts
Peak Forward Surge Current per Fig.5 (Note 3) IFSM 100 Amps
Maximum Instantaneous Forward Voltage at 25A (Note 4) VF SEE NOTE 3,4 Volts
Operating and Storage Temperature Range TJ, TSTG -55 to + 150 °C

NOTES :
1. Non-repetitive current pulse, per Fig.3 and derated above TA = 25°C per Fig.2.
2. Mounted on 0.31 X 0.31"( 8.0 X 8.0mm) copper pad to each terminal.
3. Lead temperature at TL = 25°C
4. Measured on 8.3mS single half sine-wave duty cycle = 4 pules per minute maximum.
5. VF = 3.5V on TFMCJ-5.0 thru TFMCJ-90 devices and VF = 5.0V on TFMCJ-100 thru TFMCJ-170 devices.


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