Features: • Compliant to the latest IrDA physical layer specification (up to 4 Mbit/s) with an extended low power range of > 70 cm (typ. 1 m) and TV remote control (> 9 m)• Operates from 2.4 V to 3.6 V within specification• Low power consumption (1.8 mA typ. supply current)...
TFDU6301: Features: • Compliant to the latest IrDA physical layer specification (up to 4 Mbit/s) with an extended low power range of > 70 cm (typ. 1 m) and TV remote control (> 9 m)• Operate...
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• Compliant to the latest IrDA physical layer specification (up to 4 Mbit/s) with an extended low power range of > 70 cm (typ. 1 m) and TV remote control (> 9 m)
• Operates from 2.4 V to 3.6 V within specification
• Low power consumption (1.8 mA typ. supply current)
• Power shutdown mode (0.01 A typ. shutdown current)
• Surface mount package
- Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
• Tri-state-receiver output, floating in shut down with a weak pull-up
• Low profile (universal) package capable of surface mount soldering to side and top view orientation
• Directly interfaces with various super I/O and controller devices
• Only one external component required
• Split power supply, transmitter and receiver can be operated from two power supplies with relaxed requirements saving costs
• Internal logic voltage reference of 1.8 V
• Lead (Pb)-free device
• Qualified for lead (Pb)-free and Sn/Pb processing (MSL4)
• Device in accordance with RoHS 2002/95/EC and WEEE 2002/96EC
Parameter | Test conditions | Symbol | Min. | Typ. | Max. | Unit |
Supply voltage range, transceiver |
0 V < VCC2 < 6 V | VCC1 | - 0.5 | 6 | V | |
Supply voltage range, transmitter |
0 V < VCC1 < 6 V | VCC2 | - 0.5 | 6.5 | V | |
Voltage at all I/O pins | Vin < VCC1 is allowed | - 0.5 | 6 | V | ||
Input currents | For all pins, except IRED anode pin |
10 | mA | |||
Output sinking current | 25 | mA | ||||
Power dissipation | PD | 500 | mW | |||
Junction temperature | TJ | 125 | ||||
Ambient temperature range (operating) |
Tamb | - 25 | + 85 | |||
Storage temperature range | Tstg | - 25 | + 85 | |||
Soldering temperature | See chapter "Recommended Solder Profiles" |
260 | ||||
Average output current | IIRED (DC) | 150 | mA | |||
Repetitive pulse output current | < 90 s, ton < 20 % | IIRED (RP) | 700 | mA | ||
ESD protection | Human body model | 1 | kV | |||
Virtual source size | Method: (1-1/e) encircled energy |
d | 1.8 | 2.0 | mm |
The TFDU6301 transceiver is an infrared transceiver module compliant to the latest IrDA physical layer low-power standard for fast infrared data communication, supporting IrDA speeds up to 4 Mbit/s (FIR), HP-SIR®, Sharp ASK® and carrier based remote control modes up to 2 MHz. Integrated within the transceiver module is a photo PIN diode, an infrared emitter (IRED), and a low-power control IC to provide a total front-end solution in a single package.
This new Vishay FIR transceiver is built in a new smaller package using the experiences of the lead frame BabyFace technology. The transceivers are capable of directly interfacing with a wide variety of I/O devices, which perform the modulation/ demodulation function. At a minimum, a VCC bypass capacitor is the only external component required implementing a complete solution. TFDU6301 has a tri-state output and is floating in shutdown mode with a weak pull-up.
An otherwise identical transceiver with supply voltage related logic levels is available as TFDU6301.