Features: • Compliant to the latest IrDA physical layer specification (up to 4 Mbit/s) with an extended low power range of > 70 cm (typ. 1 m) and TV remote control (> 9 m)• Operates from 2.4 V to 3.6 V within specification• Low power consumption (1.8 mA typ. supply current)...
TFDU6300: Features: • Compliant to the latest IrDA physical layer specification (up to 4 Mbit/s) with an extended low power range of > 70 cm (typ. 1 m) and TV remote control (> 9 m)• Operate...
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• Compliant to the latest IrDA physical layer specification (up to 4 Mbit/s) with an extended low power range of > 70 cm (typ. 1 m) and TV remote control (> 9 m)
• Operates from 2.4 V to 3.6 V within specification
• Low power consumption (1.8 mA typ. supply current)
• Power shutdown mode (0.01 A typ. shutdown current)
• Surface mount package
- Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
• Tri-state-receiver output, floating in shut down with a weak pull-up
• Low profile (universal) package capable of surface mount soldering to side and top view orientation
• Directly interfaces with various super I/O and controller devices
• Only one external component required
• Split power supply, transmitter and receiver can be operated from two power supplies with relaxed requirements saving costs
• Lead (Pb)-free device
• Qualified for lead (Pb)-free and Sn/Pb processing (MSL4)
• Device in accordance with RoHS 2002/95/EC and WEEE 2002/96EC
Parameter |
Test conditions |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Supply voltage range, transceiver |
0 V < VCC2 < 6 V |
VCC1 |
- 0.5 |
6 |
V | |
Supply voltage range, transmitter |
0 V < VCC1 < 6 V |
VCC2 |
- 0.5 |
6.5 |
V | |
Voltage at all I/O pins |
Vin < VCC1 is allowed |
- 0.5 |
6 |
V | ||
Input currents |
For all pins, except IRED anode pin |
10 |
mA | |||
Output sinking current |
25 |
mA | ||||
Power dissipation |
PD |
500 |
mW | |||
Junction temperature |
TJ |
125 |
||||
Ambient temperature range (operating) |
Tamb |
- 25 |
+ 85 |
|||
Storage temperature range |
Tstg |
- 25 |
+ 85 |
|||
Soldering temperature |
See chapter "Recommended Solder Profiles" |
260 |
||||
Average output current |
IIRED (DC) |
150 |
mA | |||
Repetitive pulse output current |
< 90 s, ton < 20 % |
IIRED (RP) |
700 |
mA | ||
ESD protection |
Human body model |
1 |
kV | |||
Virtual source size |
Method: (1-1/e) encircled energy |
d |
1.8 |
2.0 |
mm |
The TFDU6300 transceiver is an infrared transceiver module compliant to the latest IrDA physical layer low-power standard for fast infrared data communication, supporting IrDA speeds up to 4 Mbit/s (FIR), HP-SIR®, Sharp ASK® and carrier based remote control modes up to 2 MHz. Integrated within the transceiver module is a photo PIN diode, an infrared emitter (IRED), and a low-power control IC to provide a total front-end solution in a single package.
This new Vishay FIR transceiver is built in a new smaller package using the experiences of the lead frame BabyFace technology. The transceivers are capable of directly interfacing with a wide variety of I/O devices, which perform the modulation/ demodulation function. At a minimum, a VCC bypass capacitor is the only external component requiredimplementing a complete solution. TFDU6300 has a tri-state output and is floating in shutdown mode with a weak pull-up. An otherwise identical transceiver with low-voltage (1.8 V) logic levels is available as TFDU6301.