TFDT6502E

Features:

Compliant to the IrDA physical layer specification (Up to 4 Mbit/s), HPSIR), Sharp ASK) and TV Remote Control
For 3.0 V and 5.0 V Applications
Operates from 2.6 V to 5.5 V within specification, operational down to 2.4 V
Low Power Consumption (3 mA Supply Current)
Power Shutdown Mode (1
A Shutdown Current)
Four Surface Mount Package Options
Universal (9.7 * 4.7 * 4.0 mm)
Side View (13.0 * 5.95 * 5.3 mm)
Top View (13.0 * 7.6 * 5.95 mm)
Dracula (11.2 * 5.6 * 2.2 mm)
Push-Pull-Receiver Output, grounded in shutdown mode
High Efficiency Emitter
Baby Face (Universal) Package Capable of Surface Mount Soldering to Side and Top View Orientation
Directly Interfaces with Various Super I/O and Controller Devices
BuiltIn EMI Protection No External Shielding Necessary
Few External Components Required
Backward Pin to Pin Compatible to all Vishay Telefunken SIR and FIR Infrared Transceivers
Split power supply, transmitter and receiver can be operated from two power supplies with relaxed requirements, thus saving costs


Application

Notebook Computers, Desktop PCs, Palmtop Computers (Win CE, Palm PC), PDAs
Digital Still and Video Cameras
Printers, Fax Machines, Photocopiers, Screen Projectors
Telecommunication Products (Cellular Phones, Pagers)
Internet TV Boxes, Video Conferencing Systems
External Infrared Adapters (Dongles)
Medical and Industrial Data Collection Devices


Specifications

Parameters	Test Conditionsn	Symbol	Min.	Typ.	Max.	Unit
Supply Voltage Range,Transceiverc	0 V <VCC2 <6 V	VCC1	0.5		6	V
Supply Voltage Range,Transmitterm	0 V <VCC1 <6 V	VCC2	0.5		6	V
Input Currents	For all Pins, Except IRED,Anode Pin				10	mA
Output Sinking Current					25	mA
Power Dissipations	See Derating Curve	PD			350	mA
Junction Temperature		TJ			125	°C
Ambient Temperaturee Range (Operating)		Tambx	25		+85	°C
Storage Temperaturee Rangec		Tstg	25		+85	°C
Soldering TemperatureT	See Recommended Solder Profile (see Figure 11)				240	°C
Average Output Current		IIRED (DC)			130	mA
Repetitive Pulsed Output Current	<90 ms, ton <20% IRED,	IIRED (RP)			600	mA
IRED Anode Voltage		VIREDA	0.5		6	V
Transmitter Data Input Voltage		VTxd	0.5		VCC1 +0.5	V
Receiver Data Output Voltage		VRxd	0.5		VCC1 +0.5	V
Virtual Source Sizeo	Method:(11/e) encircled energyE	d	25	2.8		mm
Maximum Intensity for Class 1 Operation of IEC8251 or EN608251 worst case IrDA FIRe pulse pattern)	EN60825, 1997,cled energyE unidirectional operation,E worst case test modetion,E				320	mW/sr

Description

The TFDU6102E, TFDS6402, TFDS6502E, TFDT6502E are a family of lowpower infrared transceiver modules compliant to the IrDA physical layer standard for fast infrared data communication, supporting IrDA speeds up to 4.0 Mbit/s (FIR), HP-SIR, Sharp ASK and carrier based remote control modes up to 2 MHz. Integrated within the transceiver
modules are a photo PIN diode, an infrared emitter (IRED), and a lowpower CMOS control IC to provide a total frontend solution in a single package.

Vishay Telefunken's FIR transceivers are available in four package options, including our Baby Face package (TFDU610xE), the standard setting, once smallest FIR transceiver available on the market. This wide selection provides flexibility for a variety of applications and space constraints. The transceivers are capable of directly interfacing with a wide variety of I/O devices which perform the modulation/ demodulation function, including National Semiconductor's PC87338, PC87108 and PC87109, SMC's FDC37C669, FDC37N769 and CAM35C44, and Hitachi's SH3. At a minimum, a currentlimiting resistor in series with the infrared emitter and a VCC bypass capacitor are the only external components required implementing a complete solution.