Features: • Epoxy molded with flat emission surface.• Copper leadframe, good heat dissipation.• Low dependence of power output over temperature.• Driving current between 8 to 15 mA.• Symmetrical beamSpecifications PARAMETERS MIN MAX UNIT CONDITI...
TEL-2E20: Features: • Epoxy molded with flat emission surface.• Copper leadframe, good heat dissipation.• Low dependence of power output over temperature.• Driving current between 8 to...
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PARAMETERS |
MIN |
MAX |
UNIT |
CONDITIONS |
Storage Temperature |
-40 |
100 |
|
|
Operating Temperature |
-20 |
85 |
|
|
Lead Solder Temperature |
260 |
|
5 seconds | |
Continuous Forward Current |
40 |
mA |
||
Continuous Reverse Voltage |
10 |
V |