Features: ` Flexible SmartVoltage Technology- 2.7 V3.6 V Read/Program/Erase- 12 V VPP Fast Production Programming` 2.7 V or 1.65 V I/O Option- Reduces Overall System Power` High Performance- 2.7 V3.6 V: 90 ns Max Access Time- 3.0 V3.6 V: 80 ns Max Access Time` Optimized Block Sizes- Eight 8-KB Blo...
TE28F400B3B110: Features: ` Flexible SmartVoltage Technology- 2.7 V3.6 V Read/Program/Erase- 12 V VPP Fast Production Programming` 2.7 V or 1.65 V I/O Option- Reduces Overall System Power` High Performance- 2.7 V3....
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Features: ` SmartVoltage Technology- Smart 3 Flash: 2.7 V or 3.3 V VCC and 2.7 V, 3.3 V or 12 V VP...
Features: ` SmartVoltage Technology- Smart 5 Flash: 5V VCC and 5V or 12V VPP`High-Performance- 4, ...
Features: ` SmartVoltage Technology- 2.7 V (Read-Only), 3.3 V or 5 V VCC and 3.3 V, 5 V, or 12 V V...
The Smart 3 Advanced Boot Block, manufactured on Intel's latest 0.25 technology, represents a featurerich olution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective, monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40- lead and 48-lead TSOP and 48-ball BGA* packages. Additional information on this product family can be obtained by accessing Intel's WWW page: http://www.intel.com/design/flash.