TDA1517ATW

Features: · Requires very few external components· Flexibility in use: mono Bridge-Tied Load (BTL) and stereo Single-Ended (SE); it should be noted that in stereo applications the outputs of both amplifiers are in opposite phase· High output power· Low offset voltage at output (important for BTL)·...

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TDA1517ATW Picture
SeekIC No. : 004516101 Detail

TDA1517ATW: Features: · Requires very few external components· Flexibility in use: mono Bridge-Tied Load (BTL) and stereo Single-Ended (SE); it should be noted that in stereo applications the outputs of both am...

floor Price/Ceiling Price

Part Number:
TDA1517ATW
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/12

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Product Details

Description



Features:

· Requires very few external components
· Flexibility in use: mono Bridge-Tied Load (BTL) and stereo Single-Ended (SE); it should be noted that in stereo applications the outputs of both amplifiers are in opposite phase
· High output power
· Low offset voltage at output (important for BTL)
· Fixed gain
· Good ripple rejection
· Mode select switch (operating, mute and standby)
· AC and DC short-circuit safe to ground and VP
· Electrostatic discharge protection
· Thermal protection
· Reverse polarity safe
· Capable of handling high energy on outputs (VP = 0 V)
· No switch-on/switch-off plop
· Low thermal resistance.



Pinout

  Connection Diagram


Specifications

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage   - 18 V
VPSC AC and DC short-circuit-safe voltage   - 18 V
Vrp reverse polarity voltage   - 6 V
ERGo energy handling capability at outputs VP = 0 V - 200 mJ
IOSM non-repetitive peak output current - 4 A
IORM repetitive peak output current - 2.5 A
Ptot total power dissipation   - 5 W
Tvj virtual junction temperature     150
Tstg storage temperature   -55 +150
Tamb ambient temperature -40 +85



Description

The TDA1517ATW is an integrated class-AB output amplifier contained in a plastic heatsink thin shrink small outline package (HTSSOP20). The device is primarily developed for multimedia applications.




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