Features: • Fast access time (the following are maximum values) TC55VZM216AJJN/AFTN08:8 ns TC55VZM216AJJN/AFTN10:10 ns TC55VZM216AJJN/AFTN12:12 ns• Low-power dissipation (IDDO2)• Single power supply voltage of 3.3 V ± 0.3 V• Fully static operation• All inputs and outp...
TC55VZM216AFTN12: Features: • Fast access time (the following are maximum values) TC55VZM216AJJN/AFTN08:8 ns TC55VZM216AJJN/AFTN10:10 ns TC55VZM216AJJN/AFTN12:12 ns• Low-power dissipation (IDDO2)• S...
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Features: Very Low Dropout Voltage....120mV typ at 100mA 380mV typ at 200mAHigh Output Current.......
Features: • Low power dissipation: 27.5mW/MHz (typ.)• Standby current: 4m A (max.) at ...
SYMBOL | RATING | VALUE | UNIT |
VDD | Power Supply Voltage | −0.5 to 4.6 | V |
VIN | Input Terminal Voltage | −0.5* to 4.6 | V |
VI/O | Input/Output Terminal Voltage | −0.5* to VDD + 0.5** | V |
PD | Power Dissipation | 1.4 | W |
Tsolder | Soldering Temperature (10s) | 260 | °C |
Tstg | Storage Temperature | −65 to 150 | °C |
Topr | Operating Temperature | −10 to 85 | °C |
*: −1.5 V with a pulse width of 20% of tRC min (4 ns max)
**: VDD + 1.5 V with a pulse width of 20% of tRC min (4 ns max)
The TC55VZM216AFTN12 is a 4,194,304-bit high-speed static random access memory (SRAM) organized as 262,144 words by 16 bits. Fabricated using CMOS technology and advanced circuit techniques to provide high speed, it operates from a single 3.3 V power supply. Chip enable (CE ) can be used to place the device in a low-power mode, and output enable (OE ) provides fast memory access. Data byte control signals ( LB , UB) provide lower and upper byte access. This TC55VZM216AFTN12 is well suited to cache memory applications where high-speed access and high-speed storage are required. All inputs and outputs are directly LVTTL compatible. The TC55VZM216AFTN12 is available in plastic 44-pin SOJ and TSOP with 400mil width for high density surface assembly