TC55VCM316BTGN55

PinoutDescriptionThe TC55VCM316BTGN55 is designed as one kind of 4,194,304-bit static random access memory (SRAM) device that is organized as 524,288 words by 8 bits. Fabricated using Toshiba's CMOS Silicon gate process technology, this TC55VCM316BTGN55 operates from a single 2.3 to 3.6 V power su...

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SeekIC No. : 004514154 Detail

TC55VCM316BTGN55: PinoutDescriptionThe TC55VCM316BTGN55 is designed as one kind of 4,194,304-bit static random access memory (SRAM) device that is organized as 524,288 words by 8 bits. Fabricated using Toshiba's CMOS...

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Part Number:
TC55VCM316BTGN55
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/12

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Description

The TC55VCM316BTGN55 is designed as one kind of 4,194,304-bit static random access memory (SRAM) device that is organized as 524,288 words by 8 bits. Fabricated using Toshiba's CMOS Silicon gate process technology, this TC55VCM316BTGN55 operates from a single 2.3 to 3.6 V power supply. Also it is available in a plastic 40-pin thin-small outline package (TSOP).

Features of the TC55VCM316BTGN55 are:(1)Low-power dissipation Operating: 9 mW/MHz (typical); (2)Single power supply voltage of 2.3 to 3.6 V; (3)Power down features usingCE1 and CE2; (4)Data retention supply voltage of 1.5 to 3.6 V; (5)Direct TTL compatibility for all inputs and outputs; (6)Wide operating temperature range of -40 to 85 .

The absolute maximum ratings of the TC55VCM316BTGN55 can be summarized as:(1)Power Supply Voltage: -0.3 to 4.2 V;(2)Input Voltage: -0.3 to 4.2 V;(3)Input/Output Voltage: -0.5 to VDD+0.5 V;(4)Power Dissipation: 0.6 W;(5)Soldering Temperature (10s): 260 °C;(6)Storage Temperature: -55 to 150 °C;(7)Operating Temperature: -40 to 85 °C. If you want to know more information such as the electrical characteristics about the TC55VCM316BTGN55, please download the datasheet in www.seekic.com or www.chinaicmart.com.




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